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US 2012/0266972 A1Published application
Rotational-flow spray nozzle and process of using same
AssigneeIntel Corporation
InventorsHarikrishnan RAMANAN, Nitin DESHPANDE, Sabina J. HOULE
Life of this patent
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Abstract
A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
Claims10
An apparatus comprising:
- a coaxial fluid-flow cap having a longitudinal symmetry line;
- a solder flux liquid inlet tube disposed within the coaxial fluid-flow cap;
- and
- a fluid-injection port disposed at the coaxial fluid-flow cap, wherein the fluid-injection port is configured to perturb solder flux liquid flow from the solder flux liquid inlet tube.
1 more element
Dependencies are inferred from the claim text.