Sensor device with sealing structure
AssigneeFreescale Semiconductor, Inc.
InventorsStephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
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Abstract
Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
Claims20
A sensor device comprising:
- a sensor structure including a first portion having a sensing arrangement formed thereon;
- a second structure;
- and
- a sealing structure interposed between the sensor structure and the second structure, the sealing structure surrounding the first portion of the sensor structure to establish a fixed reference pressure on a first side of the first portion, wherein a second side of the first portion is exposed to an ambient pressure.
A pressure sensor device comprising:
- a pressure sensor structure including a diaphragm region having a sensing arrangement formed on a first side of the pressure sensor structure;
- a metal material circumscribing the diaphragm region, the metal material being bonded to the first side of the pressure sensor structure;
- and
- a substrate having a planar surface, wherein the metal material is bonded to the planar surface of the substrate to establish a chamber having a fixed reference pressure.
A sensor device comprising:
- a sensor structure including a diaphragm region having a sensing arrangement formed thereon;
- a substrate;
- a sealing structure bonded to a first side of the sensor structure and the substrate, the sealing structure circumscribing the diaphragm region on the first side of the sensor structure;
- and
- a capping member bonded to the substrate, the capping member covering the sensor structure to establish a fixed reference pressure on a second side of the sensor structure, wherein the substrate includes a hole formed therein, the diaphragm region being aligned with the hole to expose the first side of the diaphragm region to an ambient pressure.
Dependencies are inferred from the claim text.