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US 2012/0259448 A1Published application
Method and system for regulating adhesive application
AssigneeHenkel Corporation
InventorsGary Rzonca, Erin Johnson
Life of this patent
Estimating the term…
Abstract
A method and system used to regulate and control adhesive application on a substrate. The system includes a control unit operable to control pressure in the conduit system in response to the signals received from a mass flow meter. The control unit is further operable to regulate consistent and even application of adhesive to a substrate.
Claims10
A system for regulated and controlled application of adhesive to substrates comprising:
- a) a hot-melt tank for containing a supply of adhesive;
- b) a level sensor in said hot-melt tank to control the flow of adhesive through a vacuum pump into said hot-melt tank;
- c) at least one applicator nozzle;
- d) a piping system for guiding the flow of adhesive from said hot-melt tank to said nozzle;
- e) an application equipment located between said hot-melt tank and said nozzle;
- f) a mass flow meter located between said application sensor and said nozzle;
- and
- g) a control unit with an associated data processing program, said control unit being operable to control pressure in said piping system in response to the signals received from said mass flow meter, said control unit operable to regulate consistent and even application of adhesive to a substrate.
5 more elements
A method for regulating application of an adhesive to a substrate comprising the steps of:
- a) inputting total target amounts of adhesive to deposit on a bag and bag dimensions into a control unit;
- b) employing said control unit to calculate bag area of application of adhesive based on bag dimensions;
- c) employing said control unit to calculate target incremental deposits of the adhesive to be applied on said bag at incremental measurements;
- d) measuring mass flow rate of the adhesive through a mass flow rate meter for an incremental period of time defining a measured incremental mass flow;
- e) transmitting said incremental measured mass from said mass flow rate meter to said control unit;
- f) comparing said measured incremental mass flow to said target incremental deposit by a control unit to determine whether the measured incremental mass flow equals the target incremental deposit defining a result;
- and
- g) adjusting the mass flow rate of the adhesive through said mass flow meter by adjustment of the pressure by said control unit in response to said results.
5 more elements
A method for the controlled application of adhesive to substrates comprising:
- a) providing an adhesive application device comprising:
- i) reservoir tank for containing a supply of adhesive,
- ii) a mass flow meter located between the tank and the nozzle, the reservoir tank and the nozzle being fluidly connected by a conduit system capable of transporting the adhesive, and
- iii) a control unit with an associated data processing program, the control unit being operable to receive mass flow rate signals from the mass flow meter, and the control unit being operable to control a pump and heating element,
- b) employing the mass flow rate meter to measure the mass throughput of the adhesive defining measured mass flow data,
- c) transmitting the measured mass flow data to the control unit;
- and
- d) control the amount of adhesive, and control consistent and even application of the adhesive on the substrate at a plurality of points along the substrate by continuous control the mass of the adhesive to be applied and selectively adjusting the output of the pump and heating element response to the signals.
5 more elements
Dependencies are inferred from the claim text.