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US 2012/0259042 A1Published application
Toughened epoxy resin formulations
AssigneeDow Global Technologies LLC
InventorsStephanie L. Potisek, Mark B. Wilson
Life of this patent
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Abstract
A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.
Claims23
A toughened epoxy resin formulation comprising (a) at least one divinylaryene dioxide, and (b) at least one toughening agent;
- wherein when the epoxy resin formulation is cured, and wherein the resulting cured product has an increased fracture toughness of greater than 0.5 MPa m1/2.
Dependencies are inferred from the claim text.