Fabrication method of substrate
AssigneeIndustrial Technology Research Institute
InventorsJing-Yi Yan, Shu-Tang Yeh
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Abstract
A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.
Claims7
A method for fabricating a substrate board, comprising:
- providing a substrate layer;
- patterning the substrate layer to form a substrate having a first surface and a second surface opposite to the first surface and comprising at least a plurality of rigid areas and a plurality of flexible areas, wherein each of the rigid areas is thicker than the flexible areas, and the substrate further has a plurality of recesses separately distributed on the second surface so as to define the rigid areas and the flexible areas;
- fabricating a plurality of electronic components on the first surface of the substrate, wherein a portion of the electronic components located in the rigid areas are thicker than the rest of the electronic components located in the flexible areas;
- and
- forming a patterned high-extensive material layer on the second surface of the substrate.
Dependencies are inferred from the claim text.