Back to results
US 2012/0258571 A1Published application
Method for fabricating a semiconductor and semiconductor package
AssigneeInfineon Technologies AG
InventorsGottfried Beer, Irmgard Escher-Poeppel
Life of this patent
Estimating the term…
Abstract
A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.
Claims20
A method for fabricating a semiconductor chip module, comprising:
- providing a first layer and a layer stack disposed on the first layer, the layer stack comprising a seed layer and a second layer;
- applying a plurality of semiconductor chips above the second layer;
- and
- separating the layer stack with the applied semiconductor chips from the first layer.
1 more element
A method for fabricating a semiconductor chip module, comprising:
- providing a dielectric layer, the dielectric layer comprising an additive, which releases a catalytic starter or an electrically conducting material upon irradiation;
- applying a plurality of semiconductor chips above the dielectric layer;
- and
- forming a plurality of electrical conductors extending through the dielectric layer to connect to contact pads on surfaces of the semiconductor chips, respectively.
1 more element
Dependencies are inferred from the claim text.