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AssigneeRescoll
InventorsMarie-Pierre Foulc, Tomas Bergara, Maxime Olive
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An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young's tensile modulus value at 25° C. of between 0.1 and 500 MPa, and includes at least one migrating agent suitable for migrating up to at least one of the interfaces of the joint (14) in order to generate interfacial detachment. A composition enabling the bonding of the assembly, a method for mounting the assembly by bonding, and a method for dismantling the bonded assembly by way of migration and creation of an interfacial detachment by localized heating are also described.
Assembly (20), comprising a first substrate (10) and a second substrate (12) that are bonded with at least one seal (14), which can be disassembled by localized heating at the interface between the seal (14) and one of the substrates (10, 12), characterized in that said seal (14) consists of polymer material that has a Young's modulus value of tensile strength at 25° C. of between 0.1 and 500 MPa, and comprises at least one migrating agent that can migrate up to at least one of the interfaces of the seal (14) for generating an interfacial detachment under the action of heat.
Dependencies are inferred from the claim text.