Copper foil and method for producing copper foil
AssigneeFurukawa Electric Co., Ltd.
InventorsKensaku Shinozaki, Akitoshi Suzuki, Takahiro Tsuruta
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Abstract
Disclosed is a surface-treated copper foil, which exhibits excellent weldability when copper foils or a copper foil and an other metal are welded with each other by ultrasonic welding. Specifically disclosed is a surface-treated copper foil which is characterized in that an organic antirust coating film is formed on at least one surface of the copper foil and the reciprocal of the electric double layer capacity representing the thickness of one surface (1/C) is 0.3-0.8 cm2/μF. The organic antirust coating film is formed from a triazole compound, a dicarboxylic acid and an amine, or alternatively formed from a tetrazole compound, a dicarboxylic acid and an amine.
Claims8
A surface-treated copper foil wherein, on at least one surface of a copper foil, an organic antirust coating having a reciprocal value of an electric double layer capacity, representing a thickness of the surface (1/C), of 0.3 to 0.8 cm2/μF, is formed.
A method of production of a surface-treated copper foil including:
- forming on at least one surface of a copper foil an organic antirust coating having a reciprocal value of an electric double layer capacity, representing the surface thickness (1/C), of 0.3 to 0.8 cm2/μF by bringing the surface of the copper foil into contact with a solution containing a triazole compound, dicarboxylic acid, and amine and drying it.
A method of production of a surface-treated copper foil including:
- forming on at least one surface of a copper foil an organic antirust coating having a reciprocal value of an electric double layer capacity, representing the surface thickness (1/C), of 0.3 to 0.8 cm2/μF by bringing the surface of the copper foil into contact with a solution containing a tetrazole compound, dicarboxylic acid, and amine and drying it.
A method of production of a surface-treated copper foil including:
- forming on at least one surface of a copper foil having a ten-point mean roughness (Rz) prescribed in JIS B 0601-1994 of 2.0 μm an organic antirust coating having a reciprocal value of an electric double layer capacity, representing the surface thickness (1/C), of 0.3 to 0.8 cm2/μF by bringing the surface of the copper foil into contact with a solution containing a triazole compound, dicarboxylic acid, and amine and drying it.
A method of production of a surface-treated copper foil including:
- forming on at least one surface of a copper foil having a ten-point mean roughness (Rz) prescribed in JIS B 0601-1994 of 2.0 μm an organic antirust coating having a reciprocal value of an electric double layer capacity, representing the surface thickness (1/C), of 0.3 to 0.8 cm2/μF by bringing the surface of the copper foil into contact with a solution containing a tetrazole compound, dicarboxylic acid, and amine and drying it.
Dependencies are inferred from the claim text.