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US 2012/0257356 A1Published application
Motherboard
AssigneeASUSTeK COMPUTER INC.
InventorsHeng-Yu Yen, Pai-Ching Huang
Life of this patent
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Abstract
A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover.
Claims14
A motherboard, comprising:
- a circuit board;
- a plurality of electronic components disposed at the circuit board;
- a metal cover covering the circuit board;
- and
- a flexible heat-conducting component disposed between the circuit board and the metal cover and contacting the electronic components and the metal cover.
2 more elements
Dependencies are inferred from the claim text.