Substrate transport method, substrate transport apparatus, and coating and developing system
AssigneeTokyo Electron Limited
InventorTokutarou HAYASHI
Life of this patent
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AssigneeTokyo Electron Limited
InventorTokutarou HAYASHI
Estimating the term…
A substrate transporting method includes: after a holding unit of a substrate holding apparatus receives a substrate from one placement location for a substrate and holds it, detecting a first positional deviation of the substrate from a reference position of the substrate on the holding unit; transporting the substrate held by the holding unit to a position facing another placement location; detecting a second positional deviation of the substrate from the reference position of the substrate on the holding unit, when the substrate is located at the position facing the another placement location; calculating, based on the first and second positional deviations, a positional displacement of the substrate relative to the holding unit that occurred during the transporting of the substrate to the position facing the another placement location; and determining whether or not the positional displacement thus calculated falls within a predetermined range.
A substrate transport method that is performed in a substrate processing system, the substrate processing system including a substrate transport apparatus, which has a holding unit configured to hold the substrate by vacuum suction and which is configured to transport the substrate held by the holding unit, the substrate processing system further including a plurality of placement locations each allowing the substrate transported by the substrate transport apparatus to be placed thereon, said method comprising:
A substrate transport apparatus that transports a substrate between a plurality of placement locations each allowing the substrate to be placed thereon, said substrate transport apparatus comprising:
Dependencies are inferred from the claim text.