Dynamic Testing Based on Thermal and Stress Conditions
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMill-Jer Wang, Ching Nen Peng, Hung-Chih Lin, Hao Chen
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Abstract
A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked system comprises a plurality of stacked dies. A temperature of the die is measured. A respective set of test conditions of the die is found from the plurality of sets of test conditions, wherein the set of test conditions corresponds to the temperature. The die is at the temperature using the set of test conditions to generate test results.
Claims20
A method comprising:
- establishing a plurality of sets of test conditions of a first die in a stacked package, wherein the plurality of test conditions are functions of temperatures of the first die, and wherein the stacked package comprises a plurality of stacked dies;
- measuring a first temperature of the first die;
- finding a respective set of test conditions of the first die from the plurality of sets of test conditions, wherein the set of test conditions corresponds to the first temperature;
- and
- testing the first die at the first temperature using the set of test conditions to generate test results.
A method comprising:
- establishing a dynamic pass/fail specification of a first die in a package, wherein the dynamic pass/fail specification is a function of temperatures of the first die, and wherein the package comprises a plurality of stacked dies;
- measuring a first temperature of the first die;
- finding a pass/fail criteria of the first die corresponding to the first temperature;
- testing the first die at the first temperature to generate test results;
- and
- comparing the test results with the pass/fail criteria to determine a pass/fail status of the first die.
A method comprising:
- providing a first and a second package identical to each other, wherein the first package comprises a first die identical to a second die in the second package;
- heating the first die by heating a first prober chuck attached to the first package to a target temperature;
- heating the second die by heating a second prober chuck attached to the second package to the target temperature;
- measuring a first temperature of the first die when the first prober chuck is at the target temperature;
- measuring a second temperature of the second die when the second prober chuck is at the target temperature, wherein the first temperature is different from the second temperature;
- finding a first set of test conditions from a lookup table storing test conditions as functions of temperatures, wherein the first set of test conditions corresponds to the first temperature;
- finding a second set of test conditions from the lookup table, wherein the second set of test conditions corresponds to the second temperature, and is different from the second set of test conditions;
- testing the first die using the first set of test conditions to generate first test results;
- and
- testing the second die using the second set of test conditions to generate second test results.
Dependencies are inferred from the claim text.