Power semiconductor module, power converting apparatus and railway car
AssigneeMitsubishi Electric Corporation
InventorsTakeshi Tanaka, Yasushi Nakayama
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AssigneeMitsubishi Electric Corporation
InventorsTakeshi Tanaka, Yasushi Nakayama
Estimating the term…
A power semiconductor module applied to a power converting apparatus for a railway car includes an element pair formed by connecting an IGBT and an SiC-FWD in anti-parallel to each other and an element pair formed by connecting an Si-IGBT and an SiC-FWD in anti-parallel to each other. The element pair and the element pair are housed in one module and configured as a 2-in-1 module in a manner that the first element pair operates as a positive side arm of the power converting apparatus and the second element pair operates as a negative side arm of the power converting apparatus. The element pairs are formed such that a ratio of an occupied area of SiC-FWD chips to an occupied area of IGBT chips in the element pairs is equal to or higher than 15% and lower than 45%.
1-11. (canceled)
A power semiconductor module applied to a power converting apparatus for a railway car, wherein
A power converting apparatus installed in a railway car and configured to convert an input direct-current voltage or alternating-current voltage into a desired alternating-current voltage and output the alternating-current voltage, wherein
A railway car comprising:
Dependencies are inferred from the claim text.