Semiconductor device

A semiconductor device comprising:

• a first semiconductor chip provided with a first semiconductor element including a plurality of element electrodes;
• and
• a first substrate having an element mounting surface on which the first semiconductor chip is mounted, wherein
• the first substrate includes
• a plurality of first electrodes, each formed on the element mounting surface and connected to one of the element electrodes,
• a plurality of first interconnects connected to the first electrodes,
• a plurality of second electrodes formed on a surface opposite to the element mounting surface,
• a plurality of second interconnects connected to the second electrodes,
• a plurality of through-hole interconnects penetrating the first substrate and connecting the first interconnects to the second interconnects, and
• a third semiconductor element,
• the first substrate and the first semiconductor chip are in a rectangular planar shape,
• a first side of the first substrate and a first side of the first semiconductor chip are arranged in a same direction, and
• the first side of the first substrate is shorter than the first side of the first semiconductor chip.