Semiconductor device and method for fabricating the same
AssigneePanasonic Corporation
InventorShinya TSUJIMOTO
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip, an electrode pad formed on the semiconductor chip, an underlying barrier metal formed on the electrode pad, a solder bump formed on the underlying barrier metal, and an underfill material surrounding the underlying barrier metal and the solder bump. A junction interface of the solder bump with the underlying barrier metal corresponds to an upper surface of the underlying barrier metal, and a portion of the underfill material bonded to a side surface of the solder bump and an end surface of the underlying barrier metal forms a right angle or an obtuse angle.
Claims8
A semiconductor device, comprising:
- a semiconductor chip;
- an electrode pad formed on the semiconductor chip;
- an underlying barrier metal formed on the electrode pad;
- a bump formed on the underlying barrier metal, and made of metal;
- and
- an underfill material surrounding the underlying barrier metal and the bump, wherein
- a junction interface of the bump with the underlying barrier metal is formed on an upper surface of the underlying barrier metal, and
- a portion of the underfill material bonded to a side surface of the bump and an end surface of the underlying barrier metal forms a right or obtuse angle.
A method for fabricating a semiconductor device, comprising:
- forming an electrode pad on a semiconductor integrated circuit formed on a semiconductor substrate;
- selectively forming a mask member around the electrode pad on the semiconductor integrated circuit;
- forming an underlying barrier metal on the electrode pad exposed from the mask member;
- forming a bump made of metal on the underlying barrier metal exposed from the mask member;
- forming a semiconductor chip by dicing the semiconductor substrate on which the bump is formed, and placing the bump of the formed semiconductor chip so as to be opposed to a wiring board, thereby flip-chip mounting the semiconductor chip on the wiring board;
- removing the mask member;
- and
- after the removing of the mask member, injecting an underfill material between the semiconductor chip and the wiring board.
Dependencies are inferred from the claim text.