A manufacturing method of a sensor device comprising:
- preparing a support member having a first support surface provided in parallel to a first reference plane within a depression and a second support surface in parallel to a second reference plane orthogonal or tilted with respect to the first reference plane;
- preparing a first IC chip having a first connection terminal and an external connection terminal on one surface side, the other surface side along the one surface being an attachment surface to the first support surface, and a second IC chip having a second connection terminal and an external connection terminal on one surface side, the other surface side along the one surface being an attachment surface to the second support surface;
- preparing a first sensor element having a first connection electrode and a second sensor element having a second connection electrode;
- preparing plural flexible wiring boards with a reinforcing part for improvement of stiffness provided above an opposite surface to the first and second IC chips side of at least one of the flexible wiring boards in ranges from attachment regions to the external connection terminals of the first and second IC chips beyond ends of the first and second IC chips in a plan view;
- preparing a package that houses the respective component elements;
- attaching the flexible wiring boards respectively to the external connection terminals of the first and second IC chips;
- providing the first and second sensor elements above the one surface sides of the first and second IC chips, and attaching the first and second connection electrodes of the first and second sensor elements to the first and second connection terminals of the first and second IC chips so that principal surfaces of the first and second sensor elements may be along the one surfaces or the other surfaces;
- performing adjustment and characteristic inspection of the first and second sensor elements and the first and second IC chips via the flexible wiring boards;
- of plural sensor units respectively including the first and second IC chips to which the first and second sensor elements and the flexible wiring boards have been attached, attaching a second sensor unit including the second IC chip to the second support surface of the support member on the other surface side of the second IC chip;
- attaching an opposite surface to the first support surface of the support member, to which the second sensor unit has been attached, to a support member bonding surface of the package;
- attaching the first sensor unit including the first IC chip, to which the flexible wiring board having the reinforcing part has been attached, to the first support surface of the support member that has been attached to the support member bonding surface of the package on the other surface side of the first IC chip;
- and
- attaching the flexible wiring boards of the first and the second sensor units to the support member bonding surface of the package.