Integrated passive component
AssigneeMicronas GmbH
InventorJoerg FRANKE
Life of this patent
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Abstract
An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, and an integrated circuit formed on the surface of the semiconductor body, whereby the integrated circuit is connected by traces to the metal surfaces, and having a dielectric passivation layer formed on the surface, and the metal surfaces are connected to pins by bonding wires, and a first coil former, formed above the dielectric layer, with a winding, whereby the winding has a first connector and a second connector, and whereby the winding is formed as a wire or litz wire and the first connector of the winding is connected to a first metal surface and the second connector to a second metal surface.
Claims20
An integrated passive component comprising:
- a semiconductor body arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the first surface, the metal surfaces being connectable to pins via bonding wires;
- an integrated circuit formed on the first surface of the semiconductor body, the integrated circuit being connectable via traces to the metal surfaces;
- a dielectric passivation layer formed on the first surface;
- a first coil former having a winding, the first coil former being arranged above the dielectric passivation layer, the winding having a first connector and a second connector, the winding being configured as a wire or strand and the first connector of the winding being connectable to a first metal surface and the second connector being connectable to a second metal surface, the first metal surface being connectable with the integrated circuit;
- and
- a magnetic field sensor arranged below the first coil former.
Dependencies are inferred from the claim text.