Mems sensor device with multi-stimulus sensing

A microelectromechanical systems (MEMS) sensor device comprising;

• a first substrate structure having a cavity formed therein;
• a second substrate structure coupled with said first substrate structure, said second substrate structure having a first sensor and a second sensor formed therein, said second sensor being laterally spaced apart from said first sensor, said first sensor being aligned with said cavity, and said second substrate structure including:
• a wafer substrate;
• an insulating layer formed on said wafer substrate;
• and
• a material layer formed on said insulating layer, wherein a sense element of said first sensor is formed in said material layer, and said second substrate structure is coupled with said first substrate structure so that said sense element is interposed between said first substrate structure and said wafer substrate;
• and
• a cap attached to said second substrate structure such that said first and second sensors are interposed between said cap and said first substrate structure, said cap having a first chamber in which said first sensor resides, and said cap having a second chamber in which said second sensor resides, wherein said first sensor is exposed to an environment external to said MEMS sensor device via one of a group consisting of said cavity and said cap.

A microelectromechanical systems (MEMS) sensor device comprising;

• a first substrate structure having a cavity formed therein;
• a second substrate structure coupled with said first substrate structure, said second substrate structure having a first sensor and a second sensor formed therein, said second sensor being laterally spaced apart from said first sensor, and said first sensor being aligned with said cavity, wherein:
• said first sensor is a pressure sensor comprising a reference element formed in said second substrate structure and a diaphragm interposed between said reference element and said cavity, said diaphragm being spaced apart from said reference element to form a gap between said diaphragm and said reference element, and said diaphragm being movable relative to said reference element in response to a pressure stimulus from an environment external to said MEMS sensor device;
• and
• said second sensor is an inertial sensor comprising a movable element formed in said second substrate structure, said movable element being movable relative to a fixed electrode element of said inertial sensor in response to a physical stimulus from said environment;
• and
• a cap attached to said second substrate structure such that said pressure sensor and said inertial sensor are interposed between said cap and said first substrate structure, wherein said pressure sensor is exposed to said environment via one of a group consisting of said cavity and said cap.