Semiconductor device
AssigneeRohm Co., Ltd.
InventorsKatsuhiko Yoshihara, Masaru Ishii, Kouichi Kitaguro
Life of this patent
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Abstract
Disclosed is a semiconductor device having a structure capable of reducing the self-inductance of internal wiring. The semiconductor device includes: a lower board having a lower conductor layer formed on the surface thereof; a switching element bonded to the lower conductor layer in an element bonding area; a terminal bonded to the lower conductor layer in a terminal bonding area; an upper board stacked on the lower board in a board bonding area between the element bonding area and the terminal bonding area, and having an upper conductor layer on the surface thereof; and a switching element connecting member which connects the switching element with the upper conductor layer.
Claims20
A semiconductor device comprising:
- a lower board having a lower conductor layer formed on a surface thereof;
- a switching element bonded to the lower conductor layer in an element bonding area;
- a terminal bonded to the lower conductor layer in a terminal bonding area;
- an upper board stacked on the lower board in a board bonding area between the element bonding area and the terminal bonding area, and having an upper conductor layer on a surface thereof;
- and
- a switching element connecting member which connects the switching element with the upper conductor layer.
A semiconductor device comprising:
- a first lower board having a first lower conductor layer formed on a surface thereof;
- a first switching element bonded to the first lower conductor layer in a first element bonding area;
- a first power supply terminal bonded to the first lower conductor layer in a first terminal bonding area;
- a first upper board stacked on the first lower board in a first board bonding area between the first element bonding area and the first terminal bonding area, and having a first upper conductor layer on a surface thereof;
- a first switching element connecting member which connects the first switching element with the first upper conductor layer;
- a second lower board having a second lower conductor layer formed on a surface thereof;
- a second switching element bonded to the second lower conductor layer in a second element bonding area;
- an output terminal electrically connected to the first upper conductor layer, and bonded to the second lower conductor layer in a second terminal bonding area;
- a second upper board stacked on the second lower board in a second board bonding area between the second element bonding area and the second terminal bonding area, and having a second upper conductor layer on a surface thereof,
- a second switching element connecting member which connects the second switching element with the second upper conductor layer;
- a second power supply terminal bonded to the second upper conductor layer;
- and
- a holding base which holds the first lower board and the second lower board so that the first and second terminal bonding areas are adjacent to each other.
A semiconductor device comprising:
- a board assembly including a semiconductor element and a board;
- a terminal bonded to the board assembly, and extending parallel to a principal surface of the board;
- and
- a resin case which surrounds the wiring board, wherein
- the resin case is made of an assembly including a first case component having an insertion hole through which the terminal is inserted and a second case component which is combined with the first case component.
A semiconductor device comprising:
- a board assembly including a semiconductor element and a board;
- a terminal having a bonding portion bonded to the board, a first rising portion rising from the bonding portion in a direction to separate from a principal surface of the board, a transverse portion extending from an upper end of the first rising portion along the principal surface of the board, and a second rising portion rising from the transverse portion in a direction to separate from the principal surface of the board;
- a terminal pedestal arranged between the second rising portion and the principal surface of the board;
- and
- a terminal retainer arranged so as to make contact with or approximate the transverse portion from an opposite side to the principal surface of the board.
Dependencies are inferred from the claim text.