Organic Component and Method for the Production Thereof

A method for producing a device comprising the steps of:

• providing a first substrate on which is arranged at least one optoelectronic component containing at least one organic material;
• providing a second substrate;
• arranging a bonding material on the first or second substrate in a frame type fashion, wherein a reactive material is introduced in the bonding material or said reactive material is arranged as a separate layer at at least one surface of the bonding material;
• arranging the first substrate and the second substrate relative to one another in such a way that the optoelectronic component and the bonding material are arranged between the first substrate and the second substrate, wherein the bonding material encloses the optoelectronic component in a frame type fashion;
• and
• providing an initial ignition which triggers an exothermic chemical process of the reactive material.

A device comprising:

• a first substrate;
• a second substrate;
• at least one optoelectronic component containing at least one organic material arranged on the first substrate;
• the first substrate and the second substrate being arranged relative to one another in such a way that the optoelectronic component is arranged between the first substrate and the second substrate;
• a bonding material arranged between the first substrate and the second substrate, said bonding material enclosing the optoelectronic component in a frame type fashion and mechanically connecting the first and second substrates to one another;
• wherein the bonding material was softened by means of an exothermic chemical process of a reactive material for mechanically connecting the substrates,
• wherein the first substrate and/or the second substrate are/is a glass substrate,
• wherein the bonding material comprises a glass frit or a glass solder, and
• wherein the optoelectronic component is an organic light emitting diode (OLED).