Semiconductor device and method for manufacturing the same

A semiconductor device comprising:

• a first insulating film that covers a substrate;
• a conductive plug that is embedded between a bottom surface of the first insulating film and a position of a predetermined depth from a top surface of the first insulating film at a predetermined region of the first insulating film;
• a hole portion on the conductive plug that has a top surface of the conductive plug as a bottom surface of the hole portion, and has the first insulating film as a sidewall of the hole portion at a region in which the conductive plug is disposed;
• a sidewall insulating film that covers the sidewall of the hole portion, and covers a part of the bottom surface of the hole portion;
• a variable resistance film that covers the sidewall insulating film and the bottom surface of the hole portion;
• and
• a conductive film that covers the variable resistance film.

A semiconductor device, comprising:

• having a hole portion;
• at a region in which a conductive plug is disposed, having a top surface of the conductive plug as a bottom surface of the hole portion;
• having an insulating film in which the conductive plug is formed as a sidewall of the hole portion;
• a sidewall insulating film that covers the sidewall of the hole portion, and covers part of the bottom surface of the hole portion(s);
• a variable resistance film that covers the sidewall insulating film and the bottom surface of the hole portion;
• a conductive film that covers the variable resistance film.