Method of adjusting the resonance frequency of a micro-machined vibrating element
AssigneeSTMicroelectronics S.r.l.
InventorsJean-Francois Carpentier, Fabrice Casset, Yoan Civet, Skandar Basrour
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Abstract
The present disclosure relates to a method of adjusting the resonance frequency of a vibrating element, comprising measuring the resonance frequency of the vibrating element, determining, using abacuses and as a function of the resonance frequency measured, a dimension and a position of at least one area of modified thickness to be formed on the vibrating element so that the resonance frequency thereof corresponds to a setpoint frequency, and forming on the vibrating element, an area of modified thickness of the determined dimension and position.
Claims20
A method of adjusting a resonance frequency of a vibrating element, the method comprising:
- measuring a first resonance frequency of the vibrating element;
- comparing the first resonance frequency to a reference frequency;
- determining a dimension and a position of an area of modified thickness to be formed on the vibrating element to cause the vibrating element to resonate at a second resonant frequency that substantially corresponds to the reference frequency, wherein the determined dimension and position of the area of modified thickness is a function of the first resonance frequency and the reference frequency, and
- forming the area of modified thickness on the vibrating element at the determined dimension and position.
A method comprising:
- forming vibrating elements on a first wafer;
- measuring a first resonance frequency of each of the vibrating elements on the first wafer;
- comparing the first resonance frequency of each of the vibrating elements to a reference frequency;
- determining a dimension and a position of an area of modified thickness to be formed on one or more of the vibrating elements that is configured to cause the respective vibrating elements to resonate at a second resonance frequency, wherein the second resonance frequency substantially corresponds to the reference frequency, and wherein the determined dimension and position of the area of modified thickness is a function of the first resonance frequency of one or more vibrating elements on the first wafer and the reference frequency;
- and
- forming the area of modified thickness of one or more vibrating elements on a second wafer at the respective determined dimension and position.
A wafer comprising:
- a first vibrating element and a second vibrating element formed on the wafer, the first vibrating element having a first thickness at a first position, the second vibrating element having a second thickness at a second position, wherein the first position on the first vibrating element corresponds to the second position on the second vibrating element, and wherein the first thickness is different from the second thickness.
A wafer comprising a first vibrating element and a second vibrating element formed on the wafer, each of the first and second vibrating elements having a patch formed on one area where the stress to which the vibrating element in resonance is subjected is minimum, wherein the patch formed on the first vibrating element has a first thickness and a first width, and the patch formed on the second vibrating element has a second thickness and a second width, and wherein the first and second thicknesses are the same, and the first width is different from the second width.
A wafer comprising a first vibrating element and a second vibrating element formed on the wafer, each of the first and second vibrating elements having two patchs formed respectively on two areas where the stress to which the vibrating element in resonance is subjected is minimum, wherein the patchs formed on the first vibrating element have a first thickness and a first width, and the patchs formed on the second vibrating element have a second thickness and a second width, and wherein the first and second thicknesses are the same, and the first width is different from the second width.
Dependencies are inferred from the claim text.