Mounting apparatus, electronic component placement method, and substrate manufacturing method
AssigneeSony Corporation
InventorKeisuke Ishida
Life of this patent
Estimating the term…
Abstract
A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.
Claims6
A mounting apparatus comprising:
- a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate;
- and
- a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.
An electronic component placement method comprising:
- setting an inhibit period during which, while one placing unit of a first placing unit and a second placing unit, which are each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate;
- and
- executing the at least one of the thrusting operation and the operation of leaving the substrate by the other placing unit, after elapse of the inhibit period that has been set.
A substrate manufacturing method comprising:
- setting an inhibit period during which, while one placing unit of a first placing unit and a second placing unit, which are each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate;
- and
- executing the at least one of the thrusting operation and the operation of leaving the substrate by the other placing unit, after elapse of the inhibit period that has been set.
Dependencies are inferred from the claim text.