Particle capture unit, method for manufacturing the same, and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsTsuyoshi Moriya, Syunsuke Toyoizumi, Katsuyuki Takahiro
Life of this patent
Estimating the term…
Abstract
A particle capture unit adopted to be exposed to a space in which particles fly includes at least a first layer formed of a plurality of first fiber-like materials and a second layer formed of a plurality of second fiber-like materials. The first fiber-like materials are thinner than the second fiber-like materials and arrangement density of the first fiber-like materials in the first layer is higher than that of the second fiber-like materials in the second layer, the second layer is interposed between the first layer and the space, and the first and second layers are hardened and bonded together by sintering.
Claims10
A particle capture unit adopted to be exposed to a space in which particles fly, comprising:
- at least a first layer formed of a plurality of first fiber-like materials;
- and a second layer formed of a plurality of second fiber-like materials,
- wherein the first fiber-like materials are thinner than the second fiber-like materials and arrangement density of the first fiber-like materials in the first layer is higher than that of the second fiber-like materials in the second layer,
- wherein the second layer is interposed between the first layer and the space, and
- wherein the first and second layers are hardened and bonded together by sintering.
A method for manufacturing a particle capture unit adopted to be exposed to a space in which particles fly, the method comprising:
- forming a first layer formed of a plurality of first fiber-like materials and a second layer formed of a plurality of second fiber-like materials;
- overlapping the first layer and the second layer and shaping the overlapped first and second layers into a desired shape such that the second layer is interposed between the first layer and the space;
- and
- hardening and bonding the first and second layers together by sintering,
- wherein the first fiber-like materials are thinner than the second fiber-like materials and arrangement density of the first fiber-like materials in the first layer is higher than that of the second fiber-like materials in the second layer.
A substrate processing apparatus including:
- a processing chamber in which a substrate is subjected to a predetermined process;
- an exhaust pump having a rotational blade that is rotatable at a high speed, the exhaust pump serving to exhaust a gas in the processing chamber;
- and an exhaust system which allows the processing chamber to communicate with the exhaust pump, the substrate processing apparatus comprising:
- a particle capture unit exposed to a space in the exhaust system,
- wherein the particle capture unit includes at least a first layer formed of a plurality of first fiber-like materials and a second layer formed of a plurality of second fiber-like materials,
- wherein the first fiber-like materials are thinner than the second fiber-like materials and arrangement density of the first fiber-like materials in the first layer is higher than that of the second fiber-like materials in the second layer,
- wherein the second layer is interposed between the first layer and the space, and
- wherein the first and second layers are hardened and bonded together by sintering.
Dependencies are inferred from the claim text.