Epoxy resin compositions

Abstract

An epoxy resin composition including a divinylarene dioxide, for example a divinylbenzene dioxide, wherein the divinylarene dioxide has an impurity concentration of less than about 15 weight percent styrenic impurities such as ethylstyrene. Such prepared divinylarene dioxides may be used to prepare curable epoxy resin compositions or formulations, including a blend of a divinylarene dioxide and at least another epoxy resin different from the divinylarene dioxide; and a curable epoxy resin composition including (i) the blend of epoxy resins of the divinylarene dioxide and the at least one epoxy resin different from the divinylarene dioxide; (ii) at least one curing agent; and (iii) optionally, at least one catalyst. The significantly lower concentration of styrenic impurities in the divinylarene dioxides of the present invention provides an epoxy resin composition having low viscosity, better storage stability, and better thermal stability.

Dependencies are inferred from the claim text.