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US 2012/0238104 A1Published application
Etching method, method for manufacturing semiconductor device, and etching device
AssigneeFujitsu Limited
InventorsShirou Ozaki, Masayuki Takeda
Life of this patent
Estimating the term…
Abstract
An etching method includes: applying a radiation to an etching aqueous solution; and etching a material to be etched by using the etching aqueous solution irradiated with the radiation.
Claims15
An etching method comprising:
- applying a radiation to an etching aqueous solution;
- and
- etching a material to be etched by using the etching aqueous solution irradiated with the radiation.
An etching device comprising:
- a radiation source to apply a radiation to an etching aqueous solution;
- and
- an etching bath to hold the etching aqueous solution to be irradiated with the radiation.
Dependencies are inferred from the claim text.