Method of manufacturing electronic part

A method of manufacturing an electronic part, the method comprising:

• processing a process target, including a conductive material film, above a substrate so as to produce a wiring pattern including dense wirings, in which a distance between adjacent wirings is equal to or less than a predetermined value, and sparse wirings in which a distance between adjacent wirings is larger than the predetermined value;
• forming a sacrificial film above the substrate, above which the wiring pattern is formed, such that the sacrificial film fills between the adjacent wirings in a region where the dense wirings are formed;
• removing the sacrificial film formed above the wiring pattern and the sacrificial film formed between the adjacent wirings in a region where the sparse wirings are formed while leaving the sacrificial film filled between the adjacent wirings in the region where the dense wirings are formed;
• forming an insulation film above the substrate including the wiring pattern and the remaining sacrificial film;
• forming a mask above the insulation film such that the insulation film is partially exposed at a part of the region where the dense wirings are formed and the insulation film is exposed at the region where the sparse wirings are formed;
• etching the exposed insulation film using the mask;
• removing the sacrificial film through the part of the region where the dense wirings are formed, in which the insulation film has been etched away, so that an air gap is formed between the adjacent wirings in the region where the dense wirings are formed;
• and
• forming an embedded insulation film above the substrate to fill a gap between the adjacent wirings in the region where the sparse wirings are formed after forming the air gap between the adjacent wirings in the region where the dense wirings are formed.