Method of Forming Epitaxial Film
AssigneeAthenaeum, LLC
InventorEric Ting-Shan Pan
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Abstract
A method of growing an epitaxial film and transferring it to an assembly substrate is disclosed. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.
Claims19
A method of forming an epitaxial thin film comprising:
- melting a liquid phase epitaxial material within a pocket;
- directing said liquid phase epitaxial material onto an assembly substrate using a manifold;
- retaining said assembly substrate with a first frame portion;
- wherein said assembly substrate includes a plurality of openings;
- retaining a seed substrate adjacent to said assembly substrate such that said liquid phase material is introduced into a template within said assembly substrate and contacts a surface of said seed substrate through said plurality of openings;
- controlling melting and cooling of said liquid phase epitaxial material within said assembly substrate so as to form an epitaxial layer;
- controlling a temperature of said LPE while or before moving said first frame portion and/or said second base portion so as to separate said epitaxial layer from said seed substrate;
- wherein said epitaxial layer can be transferred as a distinct layer from said seed substrate.
The method of claim 10 wherein said one or more second separate thin film epitaxial layers and said thin film epitaxial layer include different dopant species.
A method of forming an epitaxial thin film comprising:
- melting a liquid phase epitaxial material within a pocket;
- directing said liquid phase epitaxial material onto an assembly substrate using a manifold;
- retaining said assembly substrate with a first frame portion;
- wherein said assembly substrate includes a plurality of openings;
- retaining a seed substrate adjacent to said assembly substrate such that said liquid phase material is introduced into a template within said assembly substrate and contacts a surface of said seed substrate through said plurality of openings;
- controlling melting and cooling of said liquid phase epitaxial material within said assembly substrate so as to form an epitaxial layer;
- controlling a temperature of said LPE at or below a re-melting temperature of the bulk of said epitaxial layer while or before moving said first frame portion and/or said second base portion so as to separate said epitaxial layer from said seed substrate;
- wherein said epitaxial layer can be transferred as a distinct layer from said seed substrate.
Dependencies are inferred from the claim text.