Method for manufacturing semiconductor device and reinforcing plate

A method for manufacturing a semiconductor device, comprising:

• covering with a bonding material a semiconductor substrate having a first surface, a second surface opposite to the first surface, and a plurality of first pads selectively formed on the first surface side;
• attaching a reinforcing plate having a first surface, a second surface opposite to the first surface, and a plurality of first through-holes corresponding respectively to the first pads, to the semiconductor substrate while the first pads and the first through-holes being aligned to correspond to each other;
• removing the semiconductor substrate being attached to the reinforcing plate from the second surface side until becoming a predetermined thickness;
• performing a predetermined process and forming an electrode film, on the second surface side, of the semiconductor substrate;
• injecting a remover of the bonding material into the first through-holes so as to expose the first pads;
• contacting a probe and the exposed first pads through the first through-holes so as to measure a current flowing between the probe and the electrode film;
• injecting the remover of the bonding material into the first through-holes so as to separate the semiconductor substrate from the reinforcing plate;
• and
• dicing the semiconductor substrate separated from the reinforcing plate into a plurality of chips.