Semiconductor device manufacturing method

A semiconductor device manufacturing method for manufacturing a semiconductor device by use of a semiconductor manufacturing system having a vacuum chamber, and a stage disposed inside the vacuum chamber, the stage being provided with protrusions formed on an upper surface thereof, an adsorption port for adsorbing a wafer thereto, and a heating unit, the manufacturing method comprising:

• an initial process for placing the wafer over the stage, the stage being kept in an as-heated state, and setting a pressure inside the vacuum chamber to a first pressure, subsequently holding the first pressure for the duration of first time;
• and
• a heating process for raising the pressure inside the vacuum chamber to a second pressure higher than the first pressure with the stage kept in the as-heated state after the initial process to thereby heat up the wafer.