Heat conductive composite substrate having heat dissipation properties and manufacturing method thereof
AssigneeEnlight Corporation
InventorSan-Bao Lin
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Abstract
The present invention discloses a heat conductive composite substrate having heat dissipation properties and a manufacturing method thereof. The heat conductive composite substrate comprises a heat dissipation substrate and a metal diamond composite layer physically disposed on the heat dissipation substrate for passing heat energy to the heat dissipation substrate. The metal diamond composite layer is a growth substance including at least one kind metal, and the growth substance is distributed with plural diamond particles therein.
Claims10
A heat conductive composite substrate having heat dissipation properties, comprising:
- a heat dissipation substrate;
- and
- a metal diamond composite layer physically disposed on a surface of the heat dissipation substrate for transmitting heat energy to the heat dissipation substrate, wherein the metal diamond composite layer is a growth substance comprising at least one kind of metal, and the growth substance is distributed with plural diamond particles therein.
A manufacturing method of a heat conductive composite substrate, comprising:
- preparing an electroplating solution and a heat dissipation substrate;
- adding plural diamond particles in the electroplating solution;
- and
- performing an electroplating process with respect to the heat dissipation substrate to allow an electroplated growth substance to be gradually formed on a surface of the heat dissipation substrate.
Dependencies are inferred from the claim text.