Back to results
US 2012/0237385 A1Published application
Binderless Metal Injection Molding Apparatus and Method
AssigneeThe Boeing Company
InventorCarey E. Wilkinson
Life of this patent
Estimating the term…
Abstract
A metal injection molding apparatus includes a metal injection mold die having first and second die halves, a first set of features provided in the first die half, a second set of features provided in the second die half and complementary to the first set of features provided in the first die half and an ultrasonic transducer disposed in contact with the metal injection mold die. A binderless metal injection molding method is also disclosed.
Claims4
1-9. (canceled)
A binderless metal injection molding method, comprising:
- providing a metal injection mold die having die features;
- injecting metal powder into said die features of said metal injection mold die without plastic binder;
- and
- compacting said metal powder in said die features of said metal injection mold die by inducing ultrasonic vibrations in said metal injection mold die.
1 more element
Dependencies are inferred from the claim text.