Packages and methods for packaging mems microphone devices
AssigneeAnalog Devices, Inc.
InventorsThomas Goida, Jicheng Yang, Woodrow Beckford
Life of this patent
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Abstract
Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package substrate having an acoustic pathway therethrough that opens to an interior of the device. A MEMS microphone die having an integrated filter and a movable membrane is positioned within the interior of the device. The package substrate includes a conductive layer facing the interior of the device, and a package filter formed from the conductive layer is provided along the acoustic pathway, resulting in increased packaged MEMS microphone device yield.
Claims25
A packaged integrated microphone device, comprising:
- a package substrate having an acoustic pathway therethrough, wherein the acoustic pathway opens to an interior of the device, and wherein the package substrate includes a conductive layer facing the interior of the device;
- an integrated microelectromechanical systems (MEMS) microphone die positioned within the interior of the device and having a die cavity, a movable membrane, and an integrated filter, wherein the die cavity and the integrated filter allow sound wave passage from the acoustic pathway to the movable membrane, and the integrated filter is positioned between the acoustic pathway and the movable membrane;
- and
- a package filter formed from the conductive layer of the package substrate, the package filter positioned along the acoustic pathway through the package substrate, wherein the package filter is adapted to prevent particles from reaching the integrated filter.
A process of making a packaged integrated microphone device, comprising:
- providing an integrated microelectromechanical systems (MEMS) microphone die, wherein the integrated MEMS microphone die includes a die cavity, a movable membrane, and an integrated filter between the die cavity and the movable membrane;
- forming an acoustic pathway through a package substrate between an exterior of the device and an interior of the device, the package substrate including a conductive layer facing the interior of the device;
- providing a package filter along the acoustic pathway, the package filter formed from the conductive layer;
- and
- mounting the integrated MEMS microphone die in the interior of the device in a position to allow sound wave passage through the acoustic pathway, package filter, die cavity and integrated filter to the movable membrane.
A packaged microelectromechanical systems (MEMS) microphone, comprising:
- a package housing having a sound channel therethrough, wherein the sound channel communicates sound from outside the package housing to an interior of the housing, and wherein the package housing includes a conductive layer facing the interior of the housing, the conductive layer patterned to define conductive traces;
- a MEMS microphone die having a flexible diaphragm and a die filter, wherein the MEMS microphone die is positioned within the housing interior and the die filter is positioned between the sound channel and the flexible diaphragm;
- and
- a particle filter positioned to prevent particles from entering the sound channel from outside the package housing, the particle filter formed from the conductive layer of the package housing.
Dependencies are inferred from the claim text.