Electronic package structure
AssigneeCyntec Co., Ltd.
InventorsDa-Jung Chen, Chun-Tiao Liu, BAU-RU LU
Life of this patent
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Abstract
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
Claims16
An electronic package structure, comprising:
- a first conductive element;
- a body having a top surface with a cavity thereon, wherein the first conductive element is disposed in the cavity;
- a second conductive element, disposed in the body;
- an encapsulation compound having a top surface, disposed in the cavity to encapsulate the first conductive element, wherein the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound form a first surface;
- a first external electrode, electrically connected to the first conductive element;
- and
- a second external electrode, electrically connected to the second conductive element, wherein the first external electrode and the second external electrode are disposed on the first surface.
A method for manufacturing an electronic package structure, the method comprising the steps of:
- providing a first conductive element, a second conductive element and a body having a top surface with a cavity thereon, wherein the first conductive element is disposed in the cavity and the second conductive element is disposed in the body;
- forming an encapsulation compound in the cavity to encapsulate the first conductive element, wherein the encapsulation compound has a top surface, wherein the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound form a first surface;
- and
- disposing a first external electrode and a second external electrode on the first surface, wherein the first conductive element is electrically connected to the first external electrode;
- and the second conductive element is electrically connected to the second external electrode.
Dependencies are inferred from the claim text.