A method for producing a sensor device, comprising:
- preparing a supporting member having a first support face parallel to a first reference plane and a second support face parallel to a second reference plane which is orthogonal to the first reference plane or inclined relative to the first reference plane or a supporting member having a first support face parallel to a first reference plane, a second support face parallel to a second reference plane which is orthogonal to the first reference plane or inclined relative to the first reference plane, and a third support face parallel to a third reference plane which is orthogonal to the first reference plane and the second reference plane or inclined relative to the first reference plane and the second reference plane;
- preparing an IC chip provided with one face and the other face lying along the one face, the IC chip having connection terminals and external connection terminals on a side thereof where the one face is located;
- preparing a sensor element having connection electrodes;
- preparing a plurality of flexible wiring substrates, at least one of which has, on a face thereof located on a side opposite to a side where the IC chip is located, a reinforcing section that improves stiffness, the reinforcing section being provided at least from an area in which the flexible wiring substrate is attached to the external connection terminals of the IC chip to an area over an end of the IC chip;
- preparing a package that houses the component elements;
- attaching the flexible wiring substrate to the external connection terminals of the IC chip;
- disposing the sensor element on a side of the IC chip where the one face is located and attaching the connection electrodes of the sensor element to the connection terminals of the IC chip in such a way that a principal surface of the sensor element lies along the one face or the other face;
- performing adjustment and characteristic inspection on the sensor element and the IC chip via the flexible wiring substrate;
- attaching a side of a sensor unit provided with the IC chip to which the sensor element and the flexible wiring substrate are attached, the side where the other face of the IC chip is located, to at least one of support faces of the first to third support faces of the supporting member, the support faces which are orthogonal to a supporting member joint surface of the package or inclined relative to the supporting member joint surface of the package;
- attaching the supporting member to which the sensor unit is attached to the supporting member joint surface of the package;
- attaching a side of another sensor unit to which the flexible wiring substrate provided with the reinforcing section is attached, the side where the other face of the IC chip is located, to a support face of the first to the third support faces of the supporting member attached to the supporting member joint surface of the package, the support face lying along the supporting member joint surface of the package;
- and
- attaching each flexible wiring substrate of each sensor unit to the supporting member joint surface of the package.