Back to results
US 2012/0236503 A1Published application
Power semiconductor module and its attachment structure
AssigneeMitsubishi Electric Corporation
InventorsShinsuke ASADA, Yuetsu WATANABE, Yoshihito ASAO, Kenjiro NAGAO
Life of this patent
Estimating the term…
Abstract
A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.
Claims14
A power semiconductor module comprising:
- a first metal substrate on which a power semiconductor device is mounted;
- a second metal substrate on which a power semiconductor device is not mounted;
- and
- an electrically insulating resin package which seals said first metal substrate and said second metal substrate,
- wherein the back surface of said first metal substrate on the side opposite to the mounting surface of said power semiconductor device is made to expose outside said resin package to form a heat dissipation surface.
2 more elements
Dependencies are inferred from the claim text.