Sheet-shaped structure, method for manufacturing sheet-shaped structure, electronic device, and method for manufacturing electronic device
AssigneeFujitsu Limited
InventorsYoshitaka Yamaguchi, Taisuke Iwai, Masaaki Norimatsu, Shinichi Hirose, Yohei Yagishita, Yukie Sakita
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Abstract
According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.
Claims12
A sheet-shaped structure, comprising:
- a bundle structure that includes a plurality of line-shaped structures of carbon atoms;
- a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively;
- and
- a filling layer that is disposed between the line-shaped structures covered with the covering layer.
A method for manufacturing a sheet-shaped structure, comprising:
- forming a catalyst metal film on a substrate;
- forming a plurality of line-shaped structures of carbon atoms above the substrate by using the catalyst metal film as a catalyst;
- forming a covering layer by atomic layer deposition, the covering layer covering the line-shaped structures in longitudinal directions of the line-shaped structures, respectively;
- forming a filling layer between the line-shaped structures covered with the covering layer;
- and
- removing the plurality of line-shaped structures of carbon atoms from the substrate and the catalyst metal film.
An electronic device, comprising:
- a heat generator;
- a heat dissipator;
- and
- a thermal interface material disposed between the heat generator and the heat dissipator, the thermal interface material including a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.
A method for manufacturing an electronic device, comprising:
- placing a thermal interface material between a heat generator and a heat dissipator, the thermal interface material including a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, and a filling layer that is disposed between the line-shaped structures covered with the covering layer;
- melting the filling layer by heating the thermal interface material while a load is applied between the heat generator and the heat dissipator;
- and
- solidifying the filling layer by cooling the thermal interface material.
Dependencies are inferred from the claim text.