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US 2012/0236500 A1Published application
Wiring board and power conversion device
AssigneeKabushiki Kaisha Yaskawa Denki
InventorsMasato Higuchi, Yasuhiko Kawanami, Katsushi Terazono, Koji Higashikawa, Akira Sasaki, Takayuki Morihara, Takashi Aoki, Tetsuya Ito, Yukihisa Nakabayashi, Tasuku Isobe, Kiyonori Koguma
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Abstract
A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
Claims20
A wiring board comprising:
- a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element;
- a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough;
- and
- an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
1 more element
A power conversion device comprising:
- a power conversion semiconductor element;
- and
- a wiring board electrically connected to the power conversion semiconductor element, the wiring board including:
- a conductor plate including a wiring portion and an electrode portion connected to the power conversion semiconductor element,
- a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough;
- and
- an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
4 more elements
Dependencies are inferred from the claim text.