Conductive emissions protection
AssigneeAerojet Rocketdyne of DE, Inc.
InventorsThomas A. Hertel, Erich H. Soendker, Horacio Saldivar
Life of this patent
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Abstract
A multi-layer substrate includes a ground structure, a plurality of dielectric layers on the ground structure and a plurality of conductive layers separating the plurality of dielectric layers. The conductive layers include a first conductive layer and a second conductive layer and a connection electrically coupling the first conductive layer and the second conductive layer. The first conductive layer and the ground structure are configured to define a first parasitic capacitance there between and the first conductive layer and the second conductive layer are configured to define a second, negating parasitic capacitance there between.
Claims18
A multi-layer substrate comprising:
- a ground structure;
- a plurality of dielectric layers on the ground structure;
- and
- a plurality of conductive layers separating the plurality of dielectric layers, the plurality of conductive layers including a first conductive layer and a second conductive layer and a connection electrically coupling the first conductive layer and the second conductive layer, the first conductive layer and the ground structure being configured to define a first parasitic capacitance there between and the first conductive layer and the second conductive layer being configured to define a second, negating parasitic capacitance there between.
A method of manufacturing a multi-layer substrate, the method comprising:
- forming a first dielectric layer;
- forming a first conductive layer on the first dielectric layer;
- forming a second dielectric layer on the first conductive layer such that the second dielectric layer is separated by the first conductive layer from the first dielectric layer;
- forming a second conductive layer on the second dielectric layer;
- and
- electrically coupling the first conductive layer to the second conductive layer.
A method of controlling parasitic capacitance in a multi-layer substrate, the method comprising:
- providing a multi-layer substrate including a ground structure, a plurality of dielectric layers on the ground structure, and a plurality of conductive layers separating the plurality of dielectric layers, the plurality of conductive layers including a first conductive layer and a second conductive layer, the first conductive layer and the ground structure defining a first parasitic capacitance there between;
- establishing a second parasitic capacitance between the first conductive layer and the second conductive layer;
- and
- negating the effects of the first parasitic capacitance with the second parasitic capacitance with regard to electromagnetic emission to the ground structure.
Dependencies are inferred from the claim text.