Image processing-based lithography system and method of coating target object
AssigneeSnu R&Db Foundation
InventorsSung Hoon KWON, Sueun Chung, Seungah Lee, Jisung Jang, Sangkwon Han
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Abstract
A technique related with a lithography system is disclosed. The lithography system includes at least one target object disposed on a substrate, a processor configured to process an image of the target object to determine an optical pattern for a coating layer of the target object, and an exposure apparatus configured to provide light having the optical pattern determined by the processor to the substrate.
Claims20
A lithography system comprising:
- at least one target object disposed on a substrate;
- a processor configured to process an image of the target object and determine an optical pattern for a coating layer of the target object;
- and
- an exposure apparatus configured to provide the optical pattern determined by the processor to the substrate.
A method of coating a target object, comprising:
- preparing a substrate having one surface on which at least one target object is disposed;
- determining an optical pattern for a coating layer of the target object by processing an image of the target object;
- and
- providing light having the determined optical pattern to the substrate.
A method of coating a target object, comprising:
- preparing a substrate having one surface on which at least one target object is disposed;
- forming photoresist on at least a portion of surfaces of the substrate and the target object;
- forming a perimeter wall for a coating layer of the target object by processing an image of the target object;
- and
- providing a resin to the substrate and at least the partial region of the surface of the target object surrounded by the perimeter wall.
A method of coating a chip, comprising:
- preparing a plurality of chips disposed on a flexible substrate, the plurality of chips having a first arrangement on the substrate;
- changing the first arrangement into a second arrangement by deforming the flexible substrate;
- forming photoresist on at least a portion of surfaces of the substrate and the plurality of chips;
- and
- forming a first coating layer on the surfaces of the plurality of chips by selectively exposing the photoresist to light,
- wherein the first coating layer is the cured photoresist.
A chip coating system, comprising:
- a flexible substrate having one surface on which a plurality of chips having a first arrangement are disposed;
- a fixture connected to the flexible substrate and configured to deform the flexible substrate to convert the first arrangement into a second arrangement;
- a first coater configured to be capable of forming photoresist on at least a portion of surfaces of the substrate and the plurality of chips;
- and
- a lithography system configured to be capable of forming a coating layer on the surfaces of the plurality of chips by selectively exposing the photoresist to light,
- wherein the coating layer is the cured photoresist.
Dependencies are inferred from the claim text.