US 2012/0236230 A1 · DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Abstract

Disclosed is a device substrate wherein an insulating layer (60) having a terminal (24) formed on the surface thereof is formed over the entire surface of a glass substrate (20), excluding a display section, and therefore, the border (outer periphery) of the insulating layer (60) does not approach a region where an NCF (81) is provided, i.e., an area close to an LSI chip (40). This prevents the insulating layer (60) from being peeled off from the border thereof by the NCF (81), and thereby prevents the terminal (24) from breaking. Furthermore, the terminal (24) and a bump electrode (40a) are permanently pressure-bonded to each other by the elasticity of the insulating layer (60), and a stable electrical connection therebetween can be ensured.

Claims29

Dependent claims

A device substrate mounting an electronic part thereon, comprising:

an insulating substrate;
an insulating layer having a plurality of terminals to be connected to said electronic part formed thereon, the insulating layer being provided continuously between all of said plurality of terminals and said substrate, and having a prescribed elasticity;
and
an adhesive agent disposed in a prescribed area that includes an area between said insulating layer and said electronic part,
wherein an outer peripheral portion of said insulating layer is disposed outside of said prescribed area in which said adhesive agent is disposed.

2 more elements

A method for manufacturing a device substrate in which mounting an electronic part thereon is mounted on a substrate by a non conductive adhesive agent, the method comprising:

an insulating layer formation step of forming an insulating layer having a prescribed elasticity on an insulating substrate;
a terminal formation step of forming a plurality of terminals to be connected to said electronic part on said insulating layer;
a bonding preparatory step of forming an adhesive agent in a prescribed area that includes an area between said insulating layer and said electronic part;
and
a mounting step of mounting said electronic part by pressure-bonding said electronic part to said substrate using a prescribed pressure-bonding method,
wherein, in the insulating layer formation step, said insulating layer is continuously provided between all of said plurality of terminals and said substrate, and an outer peripheral portion of said insulating layer is formed outside of said prescribed area in which said adhesive agent is formed.

3 more elements

Dependencies are inferred from the claim text.

Device substrate and method for manufacturing same

Life of this patent

Device substrate and method for manufacturing same

Life of this patent

Abstract

Claims29