US 2012/0235969 A1 · THIN FILM THROUGH-GLASS VIA AND METHODS FOR FORMING SAME

Abstract

This disclosure provides systems, methods and apparatus providing electrical connections through glass substrates. In one aspect, a thin film through-glass via including a through-glass via hole and a thin conductive film that conformally coats the sidewalls of the through-glass via hole is provided. A contour of a through-glass via hole may include concave portions that overlap at a midsection of the glass, with the through-glass via hole sidewalls curved inward to form the concave portions. In another aspect, one or more methods of forming through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a contoured through-glass via hole, followed by deposition of a thin continuous film of a conductive material.

Claims35

Dependent claims

An apparatus comprising:

a glass substrate having first and second sides;
a concave first via hole having sidewalls and a via opening in the first side;
a concave second via hole having sidewalls and a via opening in the second side,
wherein the first and second via holes intersect to form a through-glass via hole and wherein the sidewalls of each of the first and second via hole are curved from their respective via openings to the intersection of the first and second via holes,
wherein a dimension of the through-glass via hole at the intersection is less than the corresponding dimension at each via opening, and
wherein a dimension at each via opening is greater than a thickness of the glass substrate;
and
a conductive thin film conformally coating the through-glass via hole, the thin film continuous from the first side to the second side.

5 more elements

Dependencies are inferred from the claim text.

Thin film through-glass via and methods for forming same

Life of this patent

Thin film through-glass via and methods for forming same

Life of this patent

Abstract

Claims35