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US 2012/0235880 A1Published application
Ultrahigh-frequency package module
AssigneeSamsung Electronics Co., Ltd.
InventorsJoon-Il KIM, Shin-Hee CHO, Young-Min LEE, Jae-Hyuck LEE, Kyu-Sub KWAK, Sung-Ku YEO
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Abstract
An ultrahigh-frequency package module is provided, including a first substrate having a plurality of power lines and a plurality of signal lines, and one or more second substrates provided on one surface of the first substrate and each being provided with at least one antenna. The second substrates are independently arranged one by one in a grid pattern along one surface of the first substrate.
Claims14
An ultrahigh-frequency package module, comprising:
- a first substrate having a plurality of power lines and a plurality of signal lines;
- and
- one or more second substrates provided on one surface of the first substrate,
- wherein each of the one or more second substrates is provided with at least one antenna, and the one or more second substrates are independently arranged one by one in a grid pattern along the one surface of the first substrate.
1 more element
Dependencies are inferred from the claim text.