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US 2012/0235764 A1Published application
Structure of transmission line for data communication and method for designing the same
AssigneeElectronics and Telecommunications Research Institute
InventorsSae Kyoung KANG, Joon Ki LEE, Joon Young HUH, Jyung Chan LEE
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Abstract
Disclosed is a structure for impedance matching by applying a CPW structure to an impedance discontinuous portion on a data signal line or using a micro-strip open stub so as to be used for high-speed transmission by a flexible PCB. According to the present invention, it is possible to fabricate a flexible PCB capable of performing low-priced and high-speed transmission.
Claims15
A structure of a transmission line for data communication, comprising:
- a first substrate layer with a data transmission line at one side thereof;
- and
- a second substrate layer having at least a part stacked on the first substrate layer and including a first layer serving as a GND and a second layer provided on the first layer and having a data communication pattern connected to the data transmission line and GND patterns which are not parallel to the data communication pattern which are formed at one side thereof.
A method for designing a transmission line for data communication, comprising:
- forming a data transmission line at one side of a first substrate layer;
- stacking at least a part of a second substrate layer having a first layer serving as a GND at the bottom thereof on the first substrate layer;
- and
- forming a data communication pattern connected to the data transmission line and GND patterns which are not parallel to the data transmission pattern at one side of a second layer disposed on the first layer included in the second substrate layer.
1 more element
Dependencies are inferred from the claim text.