Device Retention for Test Socket
AssigneeApple Inc.
InventorSanjay Iyer
Life of this patent
Estimating the term…
Abstract
Structures and techniques for restraining devices for testing. Test sockets may retain devices under test using one or more retention members protruding from sidewalls of the test sockets. Retained devices may be oriented such that contact arms may traverse horizontally to access the devices to, for example, provide desired testing environments. Devices may be retained by forces applied by the retention members to the retained devices in response to displacement, such as compression or deformation, of the retention members caused by the retained devices. Retention of the devices may be achieved without the need for additional fasteners, claims, or adjustment.
Claims25
A test socket, comprising:
- a plurality of sidewalls;
- and
- a first retention member protruding from a first sidewall of the plurality of sidewalls, the first retention member being configured to apply a force in response to displacement of the first retention member relative to the first sidewall, the force applied by the first retention member including at least a component normal to the first sidewall;
- wherein the test socket is configured to retain an integrated circuit within the test socket using the first retention member.
A test apparatus, comprising:
- a first test socket including a first retention member protruding from a first sidewall of the first test socket, the first retention member being configured to apply a force in response to displacement of the first retention member relative to the first sidewall of the first test socket, the force applied by the first retention member including at least a component normal to the first sidewall of the first test socket, wherein the first test socket is configured to retain a first integrated circuit within the first test socket using the first retention member;
- and
- a second test socket including a second retention member protruding from a first sidewall of the second test socket, the second retention member being configured to apply a force in response to displacement of the second retention member relative to the first sidewall of the second test socket, the force applied by the second retention member including at least a component normal to the first sidewall of the second test socket, wherein the second test socket is configured to retain a second integrated circuit within the second test socket using the second retention member.
A testing system, comprising:
- a processor;
- a first contact arm;
- and
- a first test socket including a first retention member protruding from a first sidewall of the first test socket, the first retention member being configured to apply a force in response to displacement of the first retention member relative to the first sidewall of the first test socket, the force applied by the first retention member including at least a component normal to the first sidewall of the first test socket, wherein the first test socket is configured to retain a first device under test within the first test socket using the first retention member;
- wherein the testing system is configured to contact the retained first device under test using the first contact arm translating along a first path, the first contact arm being controlled at least in part by the processor.
A method, comprising:
- retaining a first integrated circuit in a first test socket, the retaining the first integrated circuit using a first retention member protruding from a first sidewall of the first test socket, the first retention member applying a force to the first integrated circuit in response to displacement of the first retention member relative to the first sidewall of the first test socket;
- retaining a second integrated circuit in a second test socket, the retaining the second integrated circuit using a second retention member protruding from a first sidewall of the second test socket, the second retention member applying a force to the second integrated circuit in response to displacement of the second retention member relative to the first sidewall of the second test socket;
- contacting the first integrated circuit using a first contact arm translating along a first path;
- contacting the second integrated circuit using a second contact arm translating along a second path, the second path being substantially opposite in direction than the first path.
Dependencies are inferred from the claim text.