Systems and methods of testing semiconductor devices

A method of testing the electrical characteristics of a wafer including a semiconductor device, using a probe card including probe pins, the density of the probe pins being greater than that of electrode pads of the wafer, the method comprising:

• dividing the probe pins into active probe pins and inactive probe pins;
• and
• evaluating the electrical characteristics of the wafer using only the active probe pins.

A system to test a semiconductor device, comprising:

• a printed circuit board;
• and
• a probe card configured to transfer electrical signals between the printed circuit board and a semiconductor device, the probe card comprising a supporting board and probe pins disposed in the supporting board, the probe card configured to divide the probe pins into active probe pins configured to deliver the electrical signals to the semiconductor device, and inactive probe pins not configured to deliver the electrical signals to the semiconductor device, according to the configuration of the semiconductor device.