Dynamic quantity sensor and manufacturing method thereof
AssigneeDai Nippon Printing Co., Ltd.
InventorsMasaaki ASANO, Tsukasa YONEKAWA
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Abstract
A dynamic quantity sensor includes a first substrate, a fixed part arranged in the first substrate, a spiral shaped movable electrode arranged separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part, a fixed electrode positioned on the periphery of the movable electrode and arranged in a detection direction of a dynamic quantity, and a first terminal electrically connected to the fixed part and a second terminal electrically connected to the fixed electrode.
Claims20
A dynamic quantity sensor comprising:
- a first substrate;
- a fixed part arranged in the first substrate;
- a spiral shaped movable electrode arranged separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part;
- a fixed electrode positioned on the periphery of the movable electrode and arranged in a detection direction of a dynamic quantity;
- and
- a first terminal electrically connected to the fixed part and a second terminal electrically connected to the fixed electrode.
A manufacturing method of a dynamic quantity sensor comprising:
- etching an upper layer and a center layer of a first substrate formed from 3 layers to form a fixed part, a spiral shaped movable electrode separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part, and a fixed electrode arranged on a periphery of the movable electrode;
- forming an electrode or wire matching a formation position of the fixed part and fixed electrode on a second substrate;
- and
- bonding a surface of the first substrate formed with the fixed part, the movable electrode and the fixed electrode, with a surface of the second substrate formed with the electrode or the wire.
A manufacturing method of a dynamic quantity sensor comprising:
- forming a concave part on a glass substrate by etching;
- forming an electrode or wire on a surface of the glass substrate formed with the concave part;
- bonding a semiconductor substrate to a surface of the glass substrate formed with the electrode or wire;
- etching a surface of the semiconductor substrate not bonded with the glass substrate to form a fixed part, a spiral shaped movable electrode separated from the glass substrate, one end of the movable electrode being supported by the fixed part, and a fixed electrode arranged on a periphery of the movable electrode.
Dependencies are inferred from the claim text.