Ultra-Slim Sensor Device and Manufacturing Method Thereof
AssigneeLattron Co. Ltd.
InventorsChung Kook Lee, Young Seong Wang, Cheol Jin Jeong
Life of this patent
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Abstract
An ultra-slim sensor device, comprising: a sensor element; lead wires (or lead frames) connected to the sensor element; a support for protecting the sensor element and the lead wires disposed therein; and upper and lower films disposed on upper and lower sides of the sensor element, the lead wires and the support to insulate them, wherein a thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space between the upper and lower films.
Claims6
An ultra-slim sensor device, comprising:
- a sensor element;
- lead wires connected to the sensor element;
- a support for protecting the sensor element and the lead wires disposed therein;
- and
- upper and lower films disposed on upper and lower sides of the sensor element, the lead wires and the support to insulate them,
- wherein the thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space between the upper and lower films.
A method of manufacturing an ultra-slim sensor device, comprising the steps of:
- connecting a sensor element with lead wires;
- disposing the sensor element connected with the lead wires inside a support;
- covering the sensor element disposed inside the support with upper and lower films;
- and
- pressing the upper film using a press at 100˜250 ° C.,
- wherein the thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space from between the upper and lower films.
Dependencies are inferred from the claim text.