Method for fabricating a flexible device
AssigneeEternal Chemical Co., Ltd.
InventorsChung-Jen Wu, Chuan Zong Lee, Chih-Min An, Yi-Chung Shih, Chang-Hong Ho
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Abstract
A method for fabricating a flexible device is provided, which includes providing a rigid carrier; forming an adhesion layer with a given pattern on the rigid carrier; forming a flexible substrate layer on the rigid carrier, wherein a portion of the flexible substrate layer contacts with the rigid carrier to form a first contact interface and the remaining contacts with the adhesion layer to form a second contact interface; forming at least one device on the surface of the flexible substrate layer opposite to the first contact interface; and separating the flexible substrate from the rigid carrier through the first contact interface.
Claims14
A method for fabricating a flexible device, comprising:
- providing a rigid carrier;
- forming an adhesion layer with a given pattern on the rigid carrier;
- forming a flexible substrate layer on the rigid carrier, wherein a portion of the flexible substrate layer contacts with the rigid carrier to form a first contact interface and the remaining contacts with the adhesion layer to form a second contact interface;
- forming at least one device on a surface of the flexible substrate layer opposite to the first contact interface;
- and
- separating the flexible substrate from the rigid carrier through the first contact interface.
A method for separating a flexible substrate from a rigid carrier, comprising:
- providing a rigid carrier;
- forming an adhesion layer with a given pattern on the rigid carrier;
- forming a flexible substrate layer on the rigid carrier, wherein a portion of the flexible substrate layer contacts with the rigid carrier to form a first contact interface and the remaining contacts with the adhesion layer to form a second contact interface;
- and
- separating the flexible substrate from the rigid carrier through the first contact interface.
Dependencies are inferred from the claim text.