Semiconductor packages
AssigneeMicron Technology, Inc.
InventorsChandra Mouli, Gurtej S. Sandhu
Life of this patent
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Abstract
The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages.
Claims13
1-56. (canceled)
A semiconductor package, comprising:
- a semiconductor die having a substantially planar backside surface;
- a mat of carbon nanotubes extending across an entirety of said substantially planar backside surface.
A semiconductor package comprising a semiconductor die having a semiconductor material substrate with a frontside surface and a backside surface in opposing relation to the frontside surface;
- wherein the backside surface includes a plurality of pedestals of the semiconductor material;
- wherein the pedestals are spaced from one another by a plurality of recesses extending into the semiconductor material;
- and wherein at least some of the recess are at least partially filled with metal-coated carbon nanotubes.
A semiconductor package, comprising:
- a first semiconductor die;
- a mat of carbon nanotubes extending across an entirety of a side of the first semiconductor die;
- and
- a second semiconductor die over the mat of carbon nanotubes and thermally connecting with the first semiconductor die through the mat of carbon nanotubes.
Dependencies are inferred from the claim text.