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US 2012/0235308 A1Published application
Manufacturing method of semiconductor device, and semiconductor device
AssigneeRenesas Electronics Corporation
InventorNoriyuki TAKAHASHI
Life of this patent
Estimating the term…
Abstract
To suppress the reduction in reliability of a resin-sealed semiconductor device. A first cap (member) and a second cap (member) with a cavity (space formation portion) are superimposed and bonded together to form a sealed space. A semiconductor including a sensor chip (semiconductor chip) and wires inside the space is manufactured in the following way. In a sealing step of sealing a joint part between the caps, a sealing member is formed of resin such that an entirety of an upper surface of the second cap and an entirety of a lower surface of the first cap are respectively exposed. Thus, in the sealing step, the pressure acting in the direction of crushing the second cap can be decreased.
Claims27
A manufacturing method of a semiconductor device, comprising the steps of:
- (a) providing a first member including a first upper surface, and a first lower surface opposite to the first upper surface;
- (b) mounting a semiconductor chip including a front surface, a plurality of electrode pads faulted at the front surface, and a back surface opposite to the front surface, over the first upper surface of the first member;
- (c) electrically connecting the electrode pads of the semiconductor chip with a plurality of terminals arranged around the semiconductor chip via a plurality of wires;
- (d) after the step (c), arranging a second member including a second upper surface, a second lower surface opposite to the second upper surface, and a space formation portion formed on the second lower surface side, over the first upper surface of the first member, and bonding the first upper surface of the first member to an adhesive surface provided at outside the space formation portion of the second member via a sealing material, and forming a space so as to house the semiconductor chip and the wires in between the first member and the second member;
- and
- (e) after the step (d), sealing a joint part between the first member and the second member with resin such that an entirety of the second upper surface of the second member and an entirety of the first lower surface of the first member are respectively exposed.
3 more elements
A manufacturing method of a semiconductor device, comprising the steps of:
- (a) providing a lead frame including a die pad, a plurality of terminals arranged around the die pad, and a plurality of suspension leads integrally formed with the die pad and adapted to support the die pad;
- (b) mounting a semiconductor chip including a front surface, a plurality of electrode pads formed at the front surface, and a back surface opposite to the front surface, over the die pad;
- (c) electrically connecting the electrode pads of the semiconductor chip with the terminals via wires;
- (d) after the step (c), arranging a second member including a second upper surface, a second lower surface opposite to the second upper surface, and a second space formation portion formed on the second lower surface side, over the lead frame such that the semiconductor chip and the wires are positioned within the second space formation portion, and mounting the second member over the terminals;
- (e) after the step (d), arranging a first member including a first upper surface, a first lower surface opposite to the first upper surface, and a first space formation portion formed on the first upper surface side such that the first upper surface is opposed to the second lower surface of the second member, and bonding a first adhesive surface provided at outside the first member to a second adhesive surface provided at outside the second space formation portion of the second member via a sealing material;
- and
- (f) after the step (e), sealing a joint part between the second member and the first member with resin such that an entirety of the second upper surface of the second member and an entirety of the first lower surface of the first member are respectively exposed.
4 more elements
A semiconductor device, comprising:
- a first member including a first upper surface, and a first lower surface opposite to the first upper surface;
- a first semiconductor chip arranged over the first upper surface of the first member, said first semiconductor chip including a first front surface, first electrode pads formed at the first surface, and a back surface opposite to the first front surface;
- wires for respectively electrically connecting the electrode pads of the first semiconductor chip with a plurality of terminals arranged around the first semiconductor chip over the first member;
- a second member bonded and secured over the first upper surface of the first member so as to cover the first semiconductor chip and the wires, said second member including a second upper surface and a second lower surface opposite to the second upper surface;
- a space formed between the first member and the second member for housing therein the first semiconductor chip and the wires;
- and
- a sealing member made of resin and adapted to seal a joint part between the first member and the second member such that an entirety of the second upper surface of the second member, and an entirety of the first lower surface of the first member are respectively exposed,
- wherein the second member is bonded to the first member via a sealing member.
5 more elements
A manufacturing method of a semiconductor device, comprising the steps of:
- (a) providing a first member including a first upper surface, and a first lower surface opposite to the first upper surface;
- (b) mounting a semiconductor chip including a front surface, a plurality of electrode pads formed at the front surface, and a back surface opposite to the front surface, over the first upper surface of the first member;
- (c) electrically connecting the electrode pads of the semiconductor chip with a plurality of terminals arranged around the semiconductor chip via a plurality of wires;
- and
- (d) after the step (c), arranging a second member including a second upper surface, a second lower surface opposite to the second upper surface, and a space formation portion formed on the second lower surface side, over the first upper surface of the first member, and bonding the first upper surface of the first member to an adhesive surface provided at outside the space formation portion of the second member via a sealing material, and forming a space so as to house the semiconductor chip and the wires in between the first member and the second member.
2 more elements
A manufacturing method of a semiconductor device, comprising the steps of:
- (a) providing a lead frame including a die pad, a plurality of terminals arranged around the die pad, and a plurality of suspension leads integrally formed with the die pad and adapted to support the die pad;
- (b) mounting a semiconductor chip including a front surface, a plurality of electrode pads formed at the front surface, and a back surface opposite to the front surface, over the die pad;
- (c) electrically connecting the electrode pads of the semiconductor chip with the terminals via wires;
- (d) after the step (c), arranging a second member including a second upper surface, a second lower surface opposite to the second upper surface, and a second space formation portion formed on the second lower surface side, over the lead frame such that the semiconductor chip and the wires are positioned within the second space formation portion, and mounting the second member over the terminals;
- and
- (e) after the step (d), arranging a first member including a first upper surface, a first lower surface opposite to the first upper surface, and a first space formation portion formed on the first upper surface side such that the first upper surface is opposed to the second lower surface of the second member, and bonding a first adhesive surface provided at outside the first member to a second adhesive surface provided at outside the second space formation portion of the second member via a sealing material.
3 more elements
Dependencies are inferred from the claim text.